The OAI 205S and Suss MicroTec MA4 mask alignment and UV exposure systems are bench top tools that requires minimal clean room space. Utilizing an air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photomask alignment and uniform contact across the wafer during contact exposure. The systems are capable of one micron resolution and alignment precision. The alignment module features mask insert sets and quick-change wafer chucks that enable the use of a variety of substrates and masks without requiring tools for reconfiguration. Both systems provide collimated UV light in near UV using 500W lamps.